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This content has been downloaded from IOPscience. Please scroll down to see the full text. Flat flexible polymer heat pipes List of symbols
, 2013
"... Abstract Flat, flexible, lightweight, polymer heat pipes (FPHP) were fabricated. The overall geometry of the heat pipe was 130 mm × 70 mm × 1.31 mm. A commercially available low-cost film composed of laminated sheets of low-density polyethylene terephthalate, aluminum and polyethylene layers was us ..."
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Abstract Flat, flexible, lightweight, polymer heat pipes (FPHP) were fabricated. The overall geometry of the heat pipe was 130 mm × 70 mm × 1.31 mm. A commercially available low-cost film composed of laminated sheets of low-density polyethylene terephthalate, aluminum and polyethylene layers was used as the casing. A triple-layer sintered copper woven mesh served as a liquid wicking structure, and water was the working fluid. A coarse nylon woven mesh provided space for vapor transport and mechanical rigidity. Thermal power ranging from 5 to 30 W was supplied to the evaporator while the device was flexed at 0 • , 45 • and 90 • . The thermal resistance of the FPHP ranged from 1.2 to 3.0 K W −1 depending on the operating conditions while the thermal resistance for a similar-sized solid copper reference was a constant at 4.6 K W −1 . With 25 W power input, the thermal resistance of the liquid-vapor core of the FPHP was 23% of a copper reference sample with identical laminated polymer material. This work shows a promising combination of technologies that has the potential to usher in a new generation of highly flexible, lightweight, low-cost, high-performance thermal management solutions.
Fellow ASME
"... effort was aimed at combining the advantages of vapor chambers or two-dimensional (2D) heat pipes and solid conductors by building thin, high effective thermal conductiv-ity, flat heat pipes out of materials with thermal expansion coefficients that match current electronic devices. In addition to th ..."
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effort was aimed at combining the advantages of vapor chambers or two-dimensional (2D) heat pipes and solid conductors by building thin, high effective thermal conductiv-ity, flat heat pipes out of materials with thermal expansion coefficients that match current electronic devices. In addition to the temperature uniformity and minimal load-driven temperature variations associated with such two phase systems, in their defined paramet-ric space, flat heat pipes are particularly attractive for Department of Defense and com-mercial systems because they offer a passive, reliable, light-weight, and low-cost path for transferring heat away from high power dissipative components. However, the difference in thermal expansion coefficients between silicon or ceramic microelectronic components and metallic vapor chambers, as well as the need for a planar, chip-size attachment sur-face for these devices, has limited the use of commercial of the shelf flat heat pipes in this role. The primary TGP goal was to achieve extreme lateral thermal conductivity, in the range of 10 kW/mK–20 kW/mK or approximately 25–50 times higher than copper and 10 times higher than synthetic diamond, with a thickness of 1 mm or less. [DOI: 10.1115/1.4028890] 1
Flat Heat Pipe
, 2013
"... Transient analysis of heat transfer and fluid flow in a polymer-based Micro Flat ..."
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Transient analysis of heat transfer and fluid flow in a polymer-based Micro Flat
