Abstract—In order to build high performance real-time sens-ing systems every building block in the system should be built with a technology that allows that building block to achieve its best performance. Technologies like BJT and BICMOS are bet-ter suited for building basic analog blocks like input buffers and power amplifiers, while CMOS is the best choice for digital data processing. To build mixed-technology systems traditionally system-in-package (SiP) techniques are used. SiP integration uses bonding wires or flip chip instead of on-chip integration. In this paper we study the feasibility of using 3D stacking to in-tegrate heterogeneous blocks built using different technologies within a real-time sensing system. Several of the previous stud-ies on 3D stacking focused on integrating multiple digital blocks and using through-silicon-vias (TSVs) to transfer digital signals between the layers in a stack. In this paper we study the behavior of the analog signals traversing through TSVs and measure how well 3D stacking can enhance or limit the performance of ana-log and digital stacking. In order to quantify the power and per-formance characteristics, we modeled bonding wire, flip chip, and through-silicon-via (TSV) interfaces. Using these models we show that 3D stacking of analog and analog/digital compo-nents can double the bandwidth, increase sampling frequency by nearly two orders magnitude and and improve the signal in-tegrity by 3 dB compared to bond wires.