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2,667
Dynamic Thermal Management for High-Performance Microprocessors
- In Proceedings of the 7th IEEE Symposium on High-Performance Computer Architecture
, 2001
"... With the increasing clock rate and transistor count of today’s microprocessors, power dissipation is becoming a critical component of system design complexity. Thermal and power-delivery issues are becoming especially critical for high-performance computing systems. In this work, we investigate dyna ..."
Abstract
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Cited by 333 (5 self)
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dynamic thermal management as a technique to control CPUpower dissipation. With the increasing usage of clock gating techniques, the average power dissipation typically seen by common applications is becoming much less than the chip’s rated maximum power dissipation. However; system designers still must
Managing Energy and Server Resources in Hosting Centers
- In Proceedings of the 18th ACM Symposium on Operating System Principles (SOSP
, 2001
"... Interact hosting centers serve multiple service sites from a common hardware base. This paper presents the design and implementation of an architecture for resource management in a hosting center op-erating system, with an emphasis on energy as a driving resource management issue for large server cl ..."
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Cited by 574 (37 self)
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Interact hosting centers serve multiple service sites from a common hardware base. This paper presents the design and implementation of an architecture for resource management in a hosting center op-erating system, with an emphasis on energy as a driving resource management issue for large server
Temperature-aware microarchitecture
- In Proceedings of the 30th Annual International Symposium on Computer Architecture
, 2003
"... With power density and hence cooling costs rising exponentially, processor packaging can no longer be designed for the worst case, and there is an urgent need for runtime processor-level techniques that can regulate operating temperature when the package’s capacity is exceeded. Evaluating such techn ..."
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Cited by 478 (52 self)
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. Validation was performed using finiteelement simulation. The paper also introduces several effective methods for dynamic thermal management (DTM): “temperaturetracking” frequency scaling, localized toggling, and migrating computation to spare hardware units. Modeling temperature at the microarchitecture
Thermal Management Using Heat Sinks
, 2002
"... Thermal management is an important design consideration with complex devices running at high speeds and power levels as these devices can generate significant heat. Proper thermal management can increase product performance and life expectancy. The thermal management ..."
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Thermal management is an important design consideration with complex devices running at high speeds and power levels as these devices can generate significant heat. Proper thermal management can increase product performance and life expectancy. The thermal management
Techniques for multicore thermal management: Classification and new exploration
- In ISCA 2006
"... Power density continues to increase exponentially with each new technology generation, posing a major challenge for thermal management in modern processors. Much past work has examined microarchitectural policies for reducing total chip power, but these techniques alone are insufficient if not aimed ..."
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Cited by 146 (3 self)
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Power density continues to increase exponentially with each new technology generation, posing a major challenge for thermal management in modern processors. Much past work has examined microarchitectural policies for reducing total chip power, but these techniques alone are insufficient
Granularity of Microprocessor Thermal Management:
"... Process technology scaling, poor supply voltage scaling and the resultant exponential increase in power density have made temperature a first-class design constraint in today’s microprocessors. An interesting question in the context of thermal management and multi-core architectures is about the cor ..."
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Cited by 1 (1 self)
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Process technology scaling, poor supply voltage scaling and the resultant exponential increase in power density have made temperature a first-class design constraint in today’s microprocessors. An interesting question in the context of thermal management and multi-core architectures is about
Thermal Management Devices, and Embedded Electronics
, 1995
"... Thermal design of wearable computers: application to the Navigator 2, thermal management devices, and embedded electronics ..."
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Thermal design of wearable computers: application to the Navigator 2, thermal management devices, and embedded electronics
Carbon Foams for Thermal Management
- Carbon
, 2003
"... A unique process for the fabrication of high thermal conductivity carbon foam was developed at Oak Ridge National Laboratory (ORNL). This process does not require the traditional blowing and stabilization steps, and therefore less costly. The resulting foam can have density values between 0.2 and 0. ..."
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Cited by 10 (1 self)
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.6 g/cc and can develop bulk thermal conductivity between 40 and 180 W/m·K. Because of its low density, its high thermal conductivity, its relatively high surface area, and its open celled structure, the ORNL carbon foam is an ideal material for thermal management applications. Initial studies have
The Case for Energy-Proportional Computing
"... Energy-proportional designs would enable large energy savings in servers, potentially doubling their efficiency in real-life use. Achieving energy proportionality will require significant improvements in the energy usage profile of every system component, particularly the memory and disk subsystems. ..."
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Cited by 469 (2 self)
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. Energy efficiency, a new focus for general-purpose computing, has been a major technology driver in the mobile and embedded areas for some time. Earlier work emphasized extending battery life, but it has since expanded to include peak power reduction because thermal constraints began to limit further CPU
Recent Thermal Management Techniques for Microprocessors
"... Microprocessor design has recently encountered many constraints such as power, energy, reliability and temperature. Among these challenging issues, temperature-related issues have become especially important within the past several years. We summarize recent thermal management techniques for micropr ..."
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Cited by 4 (0 self)
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Microprocessor design has recently encountered many constraints such as power, energy, reliability and temperature. Among these challenging issues, temperature-related issues have become especially important within the past several years. We summarize recent thermal management techniques
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