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Methodology for Electromigration Signoff in the Presence of Adaptive Voltage Scaling
"... Abstract-Electromigration (EM) is a growing reliability concern in sub-22nm technology. Design teams must apply guard bands to meet EM lifetime requirements, at the cost of performance and power. However, EM lifetime analysis cannot ignore front-end reliability mechanisms such as bias temperature in ..."
Abstract
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. By applying existing statistical and physical EM models, we demonstrate that without such considerations, the inaccuracy (reduction) of EM lifetime due to improper guard band against BTl at signoff can be as high as 30 % in a 28nm FDSOI foundry technology. Furthermore, we provide signoff guidelines which
ative Commons Attribution Non-Commercial No Derivatives licence. Researchers
"... I herewith certify that all material in this dissertation which is not my own work has been properly acknowledged. ..."
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I herewith certify that all material in this dissertation which is not my own work has been properly acknowledged.
