open access to scientific and medical research

to Dr. W.P. Huang for giving me the oppor-

Micro-EHL problems of line contact have been solved by

Abstract. – We present an experimental evidence that high dimensional orbital angular momentum entanglement of a pair of photons can be survived after a photon-plasmon-photon conversion. The information of spatial modes can be coherently transmitted by surface plasmons. This experiment primarily studies the high dimensional entangled systems based on surface plasmon with subwavelength structures. It maybe useful in the investigation of spatial mode properties of surface plasmon assisted transmission through subwavelength hole arrays. Quantum entanglement is the foundation of quantum teleportation, quantum computation, quantum cryptography, superdense coding, etc. In recent years, the interest in high dimensional entangled states is steadily growing. One advantage of using multilevel systems is its promise to realize new types of quantum communication protocols [1, 2]. Additionally, the usage of multilevel systems provides a possibility to introduce very special protocol, which cannot be implemented with qubits, such as quantum bit commitment [3] and quantum coin tossing [4]. Another advantage is their possible application in the fundamental tests of quantum mechanics. The most popular approach to investigate higher dimensional systems relies on the spatial modes of down-converted photons from spontaneous parametric

Learning to predict expression efficacy of vectors in recombinant protein production

Experiences with RFID-based interactive learning in museums Yo-Ping Huang*

Studies 46(4): xxx-xxx. The Oriental delphacid bamboo genus Bambusiphaga Huang and Ding, 1979 (Hemiptera: Delphacidae), is revised to include 20 species known from China (18 species including 2 new species), Singapore (2 species),

dihydrate] Ping-Yun Huang, a * Jin-Guo Wang, a Sheng-Wu Guo b and

Copyright © 2015 Ting-Yun Huang et al. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited. Introduction. Mild traumatic brain injury (m

A nickel-tungsten alloy plating formula was developed to electrochemically fill the microvias of printed circuit boards and the through-silicon vias (TSVs) of wafers. The plating solution was composed of Ni(SO3NH2)2, citric acid, sodium citrate, Na2WO4, chloride ions, and 2-mercapto-5-benzimidazolesulfonic acid. A void-free Ni-W superfilling of a microvia and a TSV were achieved. The tungsten content in the filled alloy varied from 1.5 atom % to 5.5 atom%, depending on the plating temperature. The coefficient of thermal expansion of the filled Ni-W was theoretically calculated according the tungsten content, which was lower than that of copper. © The Author(s) 2015. Published by ECS. This is an open access article distributed under the terms of the Creative Commons Attribution 4.0 License (CC BY,