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TABLE 2a) Business Instruments Compared and Contrasted PROCESS F.A.R.

in unknown title
by unknown authors
"... In PAGE 33: ... TABLE2 b) Business Instruments Compared and Contrasted PROCESS F.... In PAGE 34: ... TABLE2 c) Business Instruments Compared and Contrasted PROCESS F.... ..."

TABLE 2a) Business Instruments Compared and Contrasted PROCESS F.A.R.

in unknown title
by unknown authors
"... In PAGE 33: ... TABLE2 b) Business Instruments Compared and Contrasted PROCESS F.... In PAGE 34: ... TABLE2 c) Business Instruments Compared and Contrasted PROCESS F.... ..."

Table 5: Data for Dies in Multichip Modules Die Power Die Size Die Centroid (x; y)

in Thermal Characterization Of Electronic Packages Using A Three-Dimensional Fourier Series Solution
by Richard Culham, M. Michael Yovanovich, A Coefficient Matrix, Bi Biot Number
"... In PAGE 10: ... value of R ja = 2.5 C=W has been selected. A ther- mal grease was used between the heat sink and the seal lid to minimize the contact resistance and to promote heat transfer to the heat sink. The MCM had 5 dies of various sizes and power levels as shown in Table5 . All exposed surfaces of the MCM are assumed to have a uniformly speci ed convective boundary condition.... ..."

Table 4.4 Dimensions for Staggered Die configuration Parameter (mm) 3-Die 5-Die 7-Die

in VISCOPLASTIC FINITE-ELEMENT SIMULATION TO PREDICT THE SOLDER JOINT FATIGUE LIFE OF DIFFERENT FLASH MEMORY DIE STACKING
by Yong Je Lee, Supervising Professor, Dereje Agonafer

Table 3: Die

in On Locally Uniformly Linearizable High Breakdown Location and Scale Functionals
by P.L. Davies

Table 19: DIE

in Cellular Encoding: Review and Critique
by Talib Hussain

Table 1: Experimental die dimensions.

in The Influence of Bubble Mechanics on Some Properties of Blown Film
by Christopher Petrie And, Christopher J. S. Petrie, Ann Petrie
"... In PAGE 3: ....033 and 0.066 (0.084cm and 0.167cm). The three dies have dimensions given in Table1 . These dies are appreciably larger than those in the experiments of Tas (4cm die diameter) and Liu et al.... ..."

Table 1. Die PG Codes

in unknown title
by unknown authors 2001

Table 1: SNAP Die Fab Status

in The SNAP project: towards sub-nanosecond arithmetic
by Michael J. Flynn, Stuart Oberman, Steve Fu, Hesham Altwaijry, Kevin Nowka Gary Bewick 1995
"... In PAGE 2: ....p. = wave pipelined, F.P. = oating-point In most of our work wevalidated our techniques by realizing implementations. Table1 is a summary of our chip fabrication activities. 2 Algorithms and Systems In the remainder of this paper we summarize some of the techniques and algorithms whichhavebeende- veloped.... In PAGE 5: ... Ea lt; Eb - same as case (a) with Ea and Eb swapped. Table1 : SNAP Addition Rounding Operations. tive, the result itself is bit-inverted to obtain a possible mantissa.... ..."
Cited by 1

Table 1: SNAP Die Fab Status

in The SNAP Project: Towards Sub-Nanosecond Arithmetic
by Michael J. Flynn, Stuart Oberman, Steve Fu, Hesham Altwaijry, Kevin Nowka, Gary Bewick, Eric Schwarz, Nhon Quach 1995
"... In PAGE 2: ....p. = wave pipelined, F.P. = oating-point In most of our work we validated our techniques by realizing implementations. Table1 is a summary of our chip fabrication activities. 2 Algorithms and Systems In the remainder of this paper we summarize some of the techniques and algorithms which have been de- veloped.... In PAGE 5: ... Ea lt; Eb - same as case (a) with Ea and Eb swapped. Table1 : SNAP Addition Rounding Operations. tive, the result itself is bit-inverted to obtain a possible mantissa.... ..."
Cited by 1
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