### Table 2. BEM results for the cylinder (a = 1.0 m) with coatings of different thickness.

"... In PAGE 11: ...entioned above. For this reason, the FEM is attempted only for the case of h = 0.05a. The commercial software ANSYS is used for the FEM analysis. Table2... In PAGE 12: ... The BEM results converged quickly with very few elements on the boundary and interface of the two materials for all the three cases studied, while the FEM results converge also for the case h = 0.05a, as shown in Table2 . A stress contour plot for the FEM solution (with 780 elements) is shown in Fig.... In PAGE 19: ... BEM results for the thermal stresses in the films of different thickness. Table2... ..."

### Table 6.1 Wavelength in the scatterer as a function of wave number k and dielectric constant epsilon1.

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### Table 3. Scattering of an incident plane wave on a circular cylinder of radius a

"... In PAGE 12: ... Numerical results A matrix free iterative solver has been implemented by utilizing the two-dimensional version of the high-frequency integrator described in the preceding sections in con- junction with the GMRES algorithm (Saad amp; Schultz 1986). Table3 shows results produced by means of this two-dimensional solver on a 1.5 GHz PC, applied to a circular cylinder of radius a.... ..."

### Table 2: Scattering of an incident plane wave on a circular cylinder of radius a

"... In PAGE 6: ... 7 Numerical results A matrix free iterative solver has been implemented by utilizing the two-dimensional version of the high-frequency integrator described in the preceding sections in conjunction with the GMRES algo- rithm [15]. Table2 shows results produced by means of this two-dimensional solver on a 1:5 GHz PC, applied to a circular cylinder of radius a. Errors were computed by comparison with an exact solution for the integral equation, and de ned as Z @ j exact slow (r) slow(r)j2 ds(r) 1=2 .... ..."

### Table 2. An inhomogeneous sample

"... In PAGE 5: ...2 Inhomogeneous Sample: Maximal Indicative Subsets In the inhomogeneous case, a sample does not have a greatest common denominator of abiotic conditions. An example sample (from the Pommeren site) is shown in Table2 , together with the possible values for the three abiotic factors for each plant species. Focusing on the acidity of a terrain shows that Angelica sylvestris and Carex acutiformis, for example, only grow under basic or neutral conditions, whereas, for example, Carex nigra and Carex panicea, found in the same sample, only grow on a slightly or fairly acid site.... ..."

### Table 2. An inhomogeneous sample

"... In PAGE 5: ...2 Inhomogeneous Sample: Maximal Indicative Subsets In the inhomogeneous case, a sample does not have a greatest common denominator of abiotic conditions. An example sample (from the Pommeren site) is shown in Table2 , together with the possible values for the three abiotic factors for each plant species. Focusing on the acidity of a terrain shows that Angelica sylvestris and Carex acutiformis, for example, only grow under basic or neutral conditions, whereas, for example, Carex nigra and Carex panicea, found in the same sample, only grow on a slightly or fairly acid site.... ..."

### Table 1: Dielectrics.

"... In PAGE 2: ... b Bandwidth. Table1 : Variables that influence latency in an interconection network. The first term (Hmintr) represents the time spent in routers, the second term (Dmin/v) is the IC latency (the time for one part of a mesage spends on the wires), and the third term (L/b) is the serialization latency (or time spent to move the whole mesage over a set of wires).... In PAGE 10: ...2 2.2 Table1 0: Resistivites from ITRS roadmap. As mentioned in Section 4, a god aproximation for an initial value of W is one half of the metal pitch.... In PAGE 18: ....5 1.5 16 10.67 16 16 Table1 2: Number of Cs for various interconection networks as a function of w, t scaling (same PIM config.) From this analysis, tre networks semingly perform best, folowed by mesh networks.... In PAGE 19: ...29 36.63 Table1 3: Data used in bufered wire analysis. Loking at Equations 19-21, we could consider delay as a function of any number of variables.... In PAGE 20: ...0 3.70 Table1 4: C estimates using data from [Balfour 206] for unbufered wire. 10 Semi-global wire data is used as semi-global interconect wil most likely be used for form the interconection network.... ..."

### Table 2: Raphael 3-D field solver results for total capacitance extrac- tion of a single victim conductor. The conductor on layer i is 20 1. Line-to-line spacing is 1, line width is 1, line thickness is 1.5, and dielectric height is 1.5. Metal fill features on layers i?1 and i+1 are 10 1 with side-to-side spacing of 1 and end-to-end spacing of 4. The dielectric permittivity was set to both 3.9 (for SiO2) and 2.7 (cf. recent announcements by Sematech [12] of new low-permittivity dielectric technologies). Layers i?2 and i+2 are set to be 40 40 ground planes.

1998

"... In PAGE 7: ...14] K. Wampler and T. Laidig, personal communication, Sept. 1997. Appendix: Fill Impact on Extraction Table2 shows capacitance extraction results obtained with the Raphael 3-D field solver from TMA/Avant!, for an isolated conductor (i) with or without fill insertion in empty regions of adjacent layers, and (ii) with or without same-layer neighbor conductors. The simulation shows that ignoring the possibility of metal fill can result in underestimation of total line capacitance by more than 50%.... ..."

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### Table 2: Raphael 3-D field solver results for total capacitance extrac- tion of a single victim conductor. The conductor on layer i is 20 1. Line-to-line spacing is 1, line width is 1, line thickness is 1.5, and dielectric height is 1.5. Metal fill features on layers i?1 and i+1 are 10 1 with side-to-side spacing of 1 and end-to-end spacing of 4. The dielectric permittivity was set to both 3.9 (for SiO2) and 2.7 (cf. recent announcements by Sematech [12] of new low-permittivity dielectric technologies). Layers i?2 and i+2 are set to be 40 40 ground planes.

1998

"... In PAGE 7: ...14] K. Wampler and T. Laidig, personal communication, Sept. 1997. Appendix: Fill Impact on Extraction Table2 shows capacitance extraction results obtained with the Raphael 3-D field solver from TMA/Avant!, for an isolated conductor (i) with or without fill insertion in empty regions of adjacent layers, and (ii) with or without same-layer neighbor conductors. The simulation shows that ignoring the possibility of metal fill can result in underestimation of total line capacitance by more than 50%.... ..."

Cited by 19

### Table 2: Raphael 3-D field solver results for total capacitance extrac- tion of a single victim conductor. The conductor on layer i is 20#021. Line-to-line spacing is 1, line width is 1, line thickness is 1.5, and dielectric height is 1.5. Metal fill features on layers i ,1andi+1 are 10#021 with side-to-side spacing of 1 and end-to-end spacing of 4. The dielectric permittivity was set to both 3.9 (for SiO2) and 2.7 (cf. recent announcements by Sematech [12] of new low-permittivity dielectric technologies). Layers i,2andi+2 are set to be 40#0240 ground planes.

1998

"... In PAGE 7: ...14] K. Wampler and T. Laidig, personal communication, Sept. 1997. Appendix: Fill Impact on Extraction Table2 shows capacitance extraction results obtained with the Raphael 3-D field solver from TMA/Avant!, for an isolated conductor (i) with or without fill insertion in empty regions of adjacent layers, and (ii) with or without same-layer neighbor conductors. The simulation shows that ignoring the possibility of metal fill can result in underestimation of total line capacitance by more than 50%.... ..."

Cited by 19