Abstract not found

Copyright c ○ 2005 by Cambridge University Press. This material is in copyright. Subject to statutory exception and to the provisions of relevant collective licensing agreements, no reproduction of any part may take place without the written permission of Cambridge University

Abstract not found

An overview of wafer-level three-dimensional (3D) integration technology is provided. The basic reasoning for pursuing 3D integration is presented, followed by a description of the possible process variations and integration schemes, as well as the process technology elements needed to implement 3D

for their endless support. iii ACKNOWLEDGEMENTS The time I have spent in graduate school at Georgia Tech has been highlighted by innu-merable positive interactions. These experiences have allowed me to grow as a student, as a researcher, and as a human being. I would like to take this opportunity to thank all those who have played a part in this. First, I would like to express my immeasurable gratitude for my advisor, Professor James D. Meindl. I consider myself extremely privileged to have the honor to have worked with him. His advice to “try simplest first ” constantly influenced my graduate research and is something I will always remember. Somehow, he always seemed to have words of encouragement and patience just when I needed to hear them most. In addition, I have to say that I also learnt so much more by simply observing him, particularly, his ability to ask the right questions, and his impeccable interpersonal skills. The camaraderie I have shared with the scholars of the Gigascale Integration (GSI)

Botiingen Foundation, andpttt.!.,.: b % / ,.,;:,c,m B<,.ik.*, second

Abstract—We have developed a MEMS probe-card technology for wafer-level testing ICs with 1-D line-arrayed or 2-D area-arrayed dense pads layouts. With a novel metal MEMS fabrication technique, an area-arrayed tip matrix is realized with an ultra-dense tip pitch of 90 μm × 196 μm for testing 2-D pad

in 3D chip stacks are listed that can leverage wafer-level bonding as cost-efficient implementation of such cooling concepts.

Abstract—This paper presents an embedded chip integra-tion technology that incorporates silicon housings and flexible Parylene-based microelectromechanical systems (MEMS) devices. Accelerated-lifetime soak testing is performed in saline at elevated temperatures to study the packaging performance

Recent years have seen an increase in the importance of on-chip wires, as they have slowed down and gates have sped up. This dissertation takes a close look at the story of wire scaling. It forecasts wire and gate characteristics from the Semiconductor Industry Association roadmap and combines them