the lowest possible supply voltage coupled with architectural, logic style, circuit, and technology optimizations. An architectural-based scaling strategy is presented which indicates that the optimum voltage is much lower than that determined by other scaling considerations. This optimum is achieved

Power dissipation and thermal issues are increasingly significant in modern processors. As a result, it is crucial that power/performance tradeoffs be made more visible to chip architects and even compiler writers, in addition to circuit designers. Most existing power analysis tools achieve

This paper describes the concept of sensor networks which has been made viable by the convergence of microelectro-mechanical systems technology, wireless communications and digital electronics. First, the sensing tasks and the potential sensor networks applications are explored, and a review

are usually formatted for use by people (e.g., the relevant content is embedded in HTML pages), so extracting their content is difficult. Wrappers are often used for this purpose. A wrapper is a procedure for extracting a particular resource's content. Unfortunately, hand-coding wrappers is tedious. We

this paper we first discuss the wire metrics of interest and examine them in a contemporary 0.25m process. We then discuss technology scaling over the next several generations, from SIA and other predictions, and how our wire metrics trend over that time. We will examine the delay and bandwidth

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Abstract—An ultra low-power, precise voltage reference using a switched-capacitor technique in 0.35- m CMOS is presented in this paper. The temperature dependence of the carrier mobility and channel length modulation effect can be effectively minimized by using 3.3 and 5 V-type transistors

A 32kb 10T subthreshold SRAM array with bit-interleaving and differential read scheme in 90nm CMOS

Abstract—A novel field-effect transistor with Si nanowire (NW) channels is developed and characterized. To enhance the film crystallinity, metal-induced lateral crystallization (MILC) and/or rapid thermal annealing (RTA) techniques are adopted in the fabrication. In the implementation of MILC