Hotspot: A compact thermal modeling method for CMOS VLSI systems

Hotspot: A compact thermal modeling method for CMOS VLSI systems (2006)

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by Wei Huang , Student Member , Shougata Ghosh , Siva Velusamy , Karthik Sankaranarayanan , Kevin Skadron , Mircea R. Stan , Senior Member , Senior Member

Venue:	IEEE Transactions on
Citations:	39 - 9 self

BibTeX

@ARTICLE{Huang06hotspot:a,
    author = {Wei Huang and Student Member and Shougata Ghosh and Siva Velusamy and Karthik Sankaranarayanan and Kevin Skadron and Mircea R. Stan and Senior Member and Senior Member},
    title = {Hotspot: A compact thermal modeling method for CMOS VLSI systems},
    journal = {IEEE Transactions on},
    year = {2006},
    volume = {14},
    pages = {501--513}
}

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Abstract

Abstract—This paper presents HotSpot—a modeling methodology for developing compact thermal models based on the popular stacked-layer packaging scheme in modern very large-scale integration systems. In addition to modeling silicon and packaging layers, HotSpot includes a high-level on-chip interconnect self-heating power and thermal model such that the thermal impacts on interconnects can also be considered during early design stages. The HotSpot compact thermal modeling approach is especially well suited for preregister transfer level (RTL) and presynthesis thermal analysis and is able to provide detailed static and transient temperature information across the die and the package, as it is also computationally efficient. Index Terms—Compact thermal model, early design stages, interconnect self-heating, temperature, VLSI. I.

Citations

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