Effects of non-uniform substrate temperature on the clock signal integrity in high performance designs (2001)
| Venue: | Proc. Custom Integrated Circuits Conf., 2001 |
| Citations: | 13 - 6 self |
BibTeX
@INPROCEEDINGS{Ajami01effectsof,
author = {Amir H. Ajami and Massoud Pedram and Kaustav Banerjee},
title = {Effects of non-uniform substrate temperature on the clock signal integrity in high performance designs},
booktitle = {Proc. Custom Integrated Circuits Conf., 2001},
year = {2001},
pages = {233--236}
}
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Abstract
Abstract- This paper presents the analysis and modeling of the nonuniform substrate temperature in high performance ICs and its effect on the integrity of the clock signal. Using a novel non-uniform temperature-dependent distributed RC interconnect delay model, the behavior of clock skew in presence of the substrate thermal gradients is analyzed and some design guidelines are provided to ensure the integrity of the clock signal. I.
Citations
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| 27 | Interconnect thermal modeling for accurate simulation of circuit timing and reliability - Chen, Li, et al. - 2000 |
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| 13 | Characterization and modeling of clock skew with process variation - Zarkesh-Ha, Mule, et al. - 1999 |
| 8 | Full chip thermal simulation - Yu - 2000 |
| 1 | C.Teng, S.Kang, “Electrothermal analysis of VLSI systems - Cheng - 2000 |
