Abstract

: We discuss the formulation and results of a simple backpropagation approach to the control of wave soldering of printed circuit cards. Small lot sizes and a large number of different circuit card designs have complicated selection of the tunable process settings at the large manufacturer we worked with. Use of a neural network predictive model results in improved precision relative to the currently used multivariate linear model. INTRODUCTION The wave solder process involves (1) preheating, (2) fluxing, (3) soldering using a wave of solder, (4) cleaning, and (5) quality control. The process must be adapted according to the design (mass, size, component density, component type, etc.) of the circuit card to optimize quality, i.e. minimize solder connection defects. Process parameters which are controllable are the preheat temperatures and the line speed. Circuit card manufacturers produce products of great diversity in small lot sizes, compounding the selection of good process...

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