Abstract

Abstract The solar industries not only suffers from shortage of silicon but also price hike as a consequence in other hand the competition are high they need to reduce the selling price in order to be competitive. With current cost of silicon wafer that representing 60% of the solar cell cost rather than getting cheaper solar cell from the manufacturer, there is a new growing trend to reduce the silicon wafer thickness from 200micron to 180 micron and future to 150 micron later and leading to new technical challenges related to manufacturing process. Specifically on wafer breakage during handling and transfer is seem to be a huge significant issue. Therefore improved methods for breakage free handling and transferring methods are needed to address. The lacking knowledge of wafer handling devices at final electrical characteristic including the pick and place, flipper over unit and rotation table which is an air flow and vacuum tip nozzle device. Final result of the project, the initial breakage rate was 0.063% reduced to 0.008%. We believe with the implementation of in line filter element and continuous improvement at tester area will contribute to zero breakage in near future. Improve method are created to future reduce and improve others failure of above mentioned mechanical and pneumatic system with kaizen approach in Semi Medium Enterprise.