Introduction 4.2 A First Glance 4.3 Interconnect Parameters --- Capacitance, Resistance, and Inductance 4.3.1 Capacitance 4.3.2 Resistance 4.3.3 Inductance 4.4 Electrical Wire Models 4.4.1 The Ideal Wire 4.4.2 The Lumped Model 4.4.3 The Lumped RC model 4.4.4 The Distributed rc Line 4.4.5 The Transmission Line 4.5 SPICE Wire Models 4.5.1 Distributed rc Lines in SPICE 4.5.2 Transmission Line Models in SPICE 4.6 Perspective: A Look into the Future chapter4.fm Page 103 Monday, September 6, 1999 1:44 PM 104 THE WIRE Chapter 4 4.1Introduction Throughout most of the past history of integrated circuits, on-chip interconnect wires were considered to be second class citizens that had only to be considered in special cases or when performing high-precision analysis. With the introduction of deep-submicron semiconductor technologies, this picture is undergoing rapid changes. The parasitics effects introduced by the wires displ