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14
FastHenry: A MultipoleAccelerated 3D Inductance Extraction Program
, 1994
"... tion based on mesh analysis can be combined with a GMRESstyle iterative matrix solution technique to make a reasonably fast 3D frequency dependent inductance and resistance extraction algorithm. Unfortunately, both the computation time and memory re quired for that approach grow faster than n 2, ..."
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Cited by 173 (39 self)
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tion based on mesh analysis can be combined with a GMRESstyle iterative matrix solution technique to make a reasonably fast 3D frequency dependent inductance and resistance extraction algorithm. Unfortunately, both the computation time and memory re quired for that approach grow faster than n 2, where n is the number of volumefilaments. In this paper, we show that it is possible to use multipoleacceleration to reduce both required memory and computation time to nearly order n. Results from examples are given to demonstrate that the multipole acceleration can reduce required computation time and memory by more than an order of magnitude for realistic packaging problems.
Efficient Techniques for Inductance Extraction of Complex 3D Geometries
, 1992
"... In this paper we describe combining a mesh analysis equation formulation technique with a precondi rioned GMRES matrix solution algorithm to accelerate the determination of inductances of complex three dimensional structures. Results from FASTHENRY, our 3D inductance eztraclion program, demonstra ..."
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Cited by 14 (9 self)
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In this paper we describe combining a mesh analysis equation formulation technique with a precondi rioned GMRES matrix solution algorithm to accelerate the determination of inductances of complex three dimensional structures. Results from FASTHENRY, our 3D inductance eztraclion program, demonstrate that the method is more than an order of magnitude faster than the standard solution techniques for large problems.
An Efficient Finite Element Method for Submicron IC Capacitance Extraction
 Proc. 26th Design Automation Conference, Las Vegas
, 1989
"... We present an accurate and efficient method for extraction of parasitic capacitances in submicron integrated circuits. The method uses a 3D finite element model in which the conductor charges are approximated by a piecewise linear function on a web of edges located on the surface of the conductors ..."
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Cited by 10 (4 self)
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We present an accurate and efficient method for extraction of parasitic capacitances in submicron integrated circuits. The method uses a 3D finite element model in which the conductor charges are approximated by a piecewise linear function on a web of edges located on the surface of the conductors. This yields a system of Green's function integral equations that is solved by a novel approximate matrix inversion technique that only utilizes the entries corresponding to pairs of finite elements that are physically close to each other. With N representing the size of the layout, this results in time and space complexities of O(N) and O(Ö##N ) respectively. The method has been implemented in an efficient layout to circuit extractor and experimental results are presented. Introduction With the decrease of feature sizes and the increase of chip dimensions in IC technology, the influence of interconnect capacitances on circuit performance is becoming more prominent. Therefore, the need f...
Electrical design of a high speed computer package
 IEEE Transactions on Components, Hybrids and Manufacturing Technology
, 1982
"... A methodology for optimizing the design of an electrical packaging system for a high speed computer is described. The pertinent parameters are first defined and their sensitivities are derived so that the proper design tradeofls can ultimately be made. From this procedure, a set of rules is generat ..."
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Cited by 8 (0 self)
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A methodology for optimizing the design of an electrical packaging system for a high speed computer is described. The pertinent parameters are first defined and their sensitivities are derived so that the proper design tradeofls can ultimately be made. From this procedure, a set of rules is generated for driving a computer aided design system. Finally, there is a discussion of design optimization and circuit and package effects on machine performance.
Preconditioning Techniques for Constrained Vector Potential Integral Equations, with Application to 3D Magnetoquasistatic Analysis of Electronic Packages
 In Proceedings of the Colorado Conference on Iterative Methods
, 1994
"... . In this paper techniques are presented for preconditioning equations generated by discretizing constrained vector integral equations associated with magnetoquasistatic analysis. Standard preconditioning approaches often fail on these problems. We present a specialized preconditioning technique an ..."
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Cited by 5 (2 self)
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. In this paper techniques are presented for preconditioning equations generated by discretizing constrained vector integral equations associated with magnetoquasistatic analysis. Standard preconditioning approaches often fail on these problems. We present a specialized preconditioning technique and prove convergence bounds independent of the constraint equations and electromagnetic excitation frequency. Computational results from analyzing several electronic packaging examples are given to demonstrate that the new preconditioning approach can sometimes reduce the number of GMRES iterations by more than an order of magnitude. 1. Introduction. The recently developed multipoleaccelerated iterative methods for solving potential integral equations have renewed interest in using discretized integral formulations for the numerical solution of geometrically complicated threedimensional problems [1, 2]. As multipolebased approaches use implicit matrix representations which can not be easi...
Accurate interconnect modeling: towards multimillion transistor chips as microwave circuits
 In Technical Digest of the 1996 IEEE/ACM Int. Conf. on ComputerAided Design
, 1996
"... Abstract — In this tutorial we discuss concepts and techniques for the accurate and efficient modeling and extraction of interconnect parasitics in VLSI designs. Due to increasing operating frequencies, microwavelike effects will become important. Therefore stronger demands are put on extraction an ..."
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Cited by 5 (0 self)
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Abstract — In this tutorial we discuss concepts and techniques for the accurate and efficient modeling and extraction of interconnect parasitics in VLSI designs. Due to increasing operating frequencies, microwavelike effects will become important. Therefore stronger demands are put on extraction and verification tools. We indicate the stateoftheart for capacitance, resistance and substrate resistance extraction and discuss some open problems. We also discuss several model reduction techniques as well as issues related to simulation and implementation in a CAD system. 1
Capacitance Extraction of 3D Conductor Systems in Dielectric Media with HighPermittivity Ratios
 Motivating, Monitoring, and Evaluating Student Projects,” in American Statistical Association Proceedings of the Section on Statistical Education
, 1999
"... We describe a perturbation formulation for the problem of computing electrostatic capacitances of multiple conductors embedded in multiple dielectric materials. Unlike the commonly used equivalentcharge formulation (ECF), this new approach insures that the capacitances are computed accurately even ..."
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Cited by 5 (2 self)
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We describe a perturbation formulation for the problem of computing electrostatic capacitances of multiple conductors embedded in multiple dielectric materials. Unlike the commonly used equivalentcharge formulation (ECF), this new approach insures that the capacitances are computed accurately even when the permittivity ratios of the dielectric materials are very large. Computational results from a threedimensional multipoleaccelerated algorithm based on this approach are presented. The results show that the accuracy of this new approach is nearly independent of the permittivity ratios and superior to the ECF for realistic interconnect structures.
Improved Integral Formulations for Fast 3D MethodofMoments Solvers
 in Proceedings of EPEP
, 2001
"... This paper introduces a new integral formulation to calculate charge densities of conductor systems that may include multiple dielectric materials. We show that the conditioning of our formulation is much better than that of the standard equivalent charge formulation. When combined with a nonstandar ..."
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Cited by 4 (2 self)
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This paper introduces a new integral formulation to calculate charge densities of conductor systems that may include multiple dielectric materials. We show that the conditioning of our formulation is much better than that of the standard equivalent charge formulation. When combined with a nonstandard discretization scheme, results can be obtained with higher accuracy at reduced numerical cost. We present a multipole accelerated implementation of our formulation. The results demonstrate that the new approach can cut the iteration count by a factor between two and four. Moreover, we will demonstrate that in the presence of sparsification errors and multiple dielectric materials secondkind formulations are much more accurate than the standard firstkind formulations.
Electronic design issues in highbandwidth parallel optical interfaces to VLSI circuits
, 1999
"... ...................................................................................................................................... viii List of publications .......................................................................................................................ix Chapter 1: Introd ..."
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Cited by 2 (1 self)
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...................................................................................................................................... viii List of publications .......................................................................................................................ix Chapter 1: Introduction..................................................................................................................1 1.1 Scope and overall research contribution..............................................................................1 1.2 Motivation............................................................................................................................2 1.2.1 The interconnect problem .............................................................................................2 1.2.2 Capabilities and limitations of electrical interconnects................................................4 1.2.3 Advantages of optical interconnects ......................................
Modeling And Simulation Of High Speed Interconnects
, 1998
"... BISWAS, BARIBRATA. Modeling and Simulation of High Speed Interconnects. (Under the direction of Michael B. Steer.) A three dimensional interconnect modeling software (Layout2FastCap) was developed that takes a Layout (CIF) as its input and generates the capacitance matrix using a multipole accelera ..."
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Cited by 1 (0 self)
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BISWAS, BARIBRATA. Modeling and Simulation of High Speed Interconnects. (Under the direction of Michael B. Steer.) A three dimensional interconnect modeling software (Layout2FastCap) was developed that takes a Layout (CIF) as its input and generates the capacitance matrix using a multipole accelerated boundary element method based numerical solver (FastCap). The software incorporates a new technique for simulating the ground plane using image method. A flow (Single Net Capacitance Extraction) was developed to handle larger layouts than that can be handled by Layout2FastCap. Experimental characterizations of the interconnects were also carried out. Results obtained from measurements were compared with the simulation results. The software Layout2FastCap is available by sending email to m.b.steer@ieee.org. Biographical Summary Baribrata Biswas was born in Ichapur, India on June 16, 1974. He received his B. Tech. degree in Electrical Engineering at the Indian Institute of Technology, Ka...