This paper studies buffer block planning for interconnect-driven floorplanning in deep submicron designs. We first introduce the concept of feasible region (FR) for buffer insertion, and derive closed-form formula for FR. We observe that the FR for a buffer is quite large in general even under fairly tight delay constraint. Therefore, FR gives us a lot of flexibility to plan for buffer locations. We then develop an effective buffer block planning (BBP) algorithm to perform buffer clustering such that the overall chip area and the buffer block number can be minimized. To the best of our knowledge, this is the first in-depth study on buffer planning for interconnect-driven floorplanning with both area and delay consideration.

Interconnect has become the dominating factor in determining circuit performance and reliability in deep submicron designs. In this embedded tutorial, we first discuss the trends and challenges of interconnect design as the technology feature size rapidly decreases towards below 0.1 micron. Then, we present commonly used interconnect models and a set of interconnect design and optimization techniques for improving interconnect performance and reliability. Finally, we present comparisons of different optimization techniques in terms of their efficiency and optimization results, and show the impact of these optimization techniques on interconnect performance in each technology generation from the 0.35µm to 0.07µm projected in the National Technology Roadmap for Semiconductors.

As the IC devices is scaled into nanometer dimen- sions and operates in giga-hertz frequencies, interconnect design and optimization have become critical in determining the system performance and reliability.

The driving force behind the spectacular advancement of the integrated circuit technology in the past thirty years has been the exponential scaling of the feature size, i.e., the minimum dimension of a transistor. It has been following the Moore's Law [1] at the rate of a factor of 0.7 reduction every three years. It is expected that such exponential scaling will continue for at least another 1012 years as projected in the recently published 1997 National Technology Roadmap for Semiconductors (NTRS'97) [2] shown in Table 1. This will lead to over half a billion transistors integrated on a single chip with an operating frequency of 2-3 GHz in the 70nm technology by Year 2009. The challenges to sustain such an exponential growth to achieve gigascale integration have shifted in a large degree, however, from the process and manufacturing technologies to the design technology. A great deal of design innovation, in terms of both significant extension of

This paper presents an efficient approach to perform global interconnect sizing and spacing (GISS) for multiple nets to minimize interconnect delays with consideration of coupling capacitance, in addition to area and fringing capacitances. We introduce the formulation of symmetric and asymmetric wire sizing and spacing. We prove two important results on the symmetric and asymmetric effective-fringing properties which leadtoavery effective bound computation algorithm to compute the upper and lower bounds of the optimal wire sizing and spacing solution for all nets under consideration. Our experiments show that in most cases the upper and lower bounds meet quickly after a few iterations and we actually obtain the optimal solution. To our knowledge, this is the first in-depth study of global wire sizing and spacing for multiple nets with consideration of coupling capacitance. Experimental results show that our GISS solutions lead to substantial delay reduction than existing single net wire-sizing solutions without consideration of coupling capacitance.

In this paper we present a new global router appropriate for Multichip Module (MCM) and dense Printed Circuit Board (PCB) design, which utilizes a hybrid of the classical rip-up and reroute approach, and the more recent iterative deletion[9] method. The global router addresses performance issues by utilizing recent results in high performance interconnect design, while still effectively minimizing global congestion. With experiments

In this paper we present a repeater block planning algorithm forinterconnect-centric floorplanning. We introduce the concept of

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To implement high-performance global interconnect without impacting the performance of existing blocks, the use of buffer blocks is increasingly popular in structured-custom and block-based ASIC/SOC methodologies. Recent works by Cong et al. [6] and Tang and Wong [25] give algorithms to solve the buffer block planning problem. In this paper we address the problem of how to perform buffering of global nets given an existing buffer block plan. Assuming as in [6, 25] that global nets have been already decomposed into two-pin connections, we give a provably good algorithm based on a recent approach of Garg and Könemann [8] and Fleischer [7]. Our method routes connections using available buffer blocks, such that required upper and lower bounds on buffer intervals – as well as wirelength upper bounds per connection – are satisfied. Unlike [6, 25], our model allows more than one buffer to be inserted into any given connection. In addition, our algorithm observes buffer parity constraints, i.e., it will choose to use an inverter or a buffer ( = co-located pair of inverters) according to source and destination signal parity. The algorithm outperforms previous approaches [6] and has been validated on top-level layouts extracted from a recent high-end microprocessor design. 1

Conventional methods for optimal sizing of wires and transistors use linear RC circuit models and the Elmore delay as a measure of signal delay. If the RC circuit has a tree topology the sizing problem reduces to a convex optimization problem which can be solved using geometric programming. The tree topology restriction precludes the use of these methods in several sizing problems of significant importance to high-performance deep submicron design including, for example, circuits with loops of resistors, e.g., clock distribution meshes, and circuits with coupling capacitors, e.g., buses with crosstalk between the lines. The paper proposes a new optimization method which can be used to address these problems. The method uses the dominant time constant as a measure of signal propagation delay in an RC circuit, instead of Elmore delay. Using this measure, sizing of any RC circuit can be cast as a convex optimization problem which can be solved using the recently developed efficient interi...