This paper presents a comprehensive survey of existing techniques for interconnect optimization during the VLSI physical design process, with emphasis on recent studies on interconnect design and optimization for high-performance VLSI circuit design under the deep submicron fabrication technologies. First, we present a number of interconnect delay models and driver/gate delay models of various degrees of accuracy and efficiency which are most useful to guide the circuit design and interconnect optimization process. Then, we classify the existing work on optimization of VLSI interconnect into the following three categories and discuss the results in each category in detail: (i) topology optimization for highperformance interconnects, including the algorithms for total wire length minimization, critical path length minimization, and delay minimization; (ii) device and interconnect sizing, including techniques for efficient driver, gate, and transistor sizing, optimal wire sizing, and simultaneous topology construction, buffer insertion, buffer and wire sizing; (iii) highperfbrmance clock routing, including abstract clock net topology generation and embedding, planar clock routing, buffer and wire sizing for clock nets, non-tree clock routing, and clock schedule optimization. For each method, we discuss its effectiveness, its advantages and limitations, as well as its computational efficiency. We group the related techniques according to either their optimization techniques or optimization objectives so that the reader can easily compare the quality and efficiency of different solutions.

Buffer insertion seeks to place buffers on the wires of a signal net to minimize delay. Van Ginneken [14] proposed an optimal dynamic programming solution (with extensions proposed by [7] [8] [9] [12]) such that at most one buffer can be placed on a single wire. This constraint can hurt solution quality, but it may be circumvented by dividing each wire into multiple smaller segments. This work studies the problem of finding the correct number of segments for each wire in the routing tree. Too few segments yields sub-par solutions, but too many segments can lead to excessive run times and memory loads. We derive new theoretical results for computing the appropriate number of buffers (and hence wire segments) which motivate our new wire segmenting algorithm. We show that using wire segmenting as a precursor to buffer insertion produces solutions within a few percent of optimal, while using only seconds of CPU time. 1 Introduction The scaling of process technology and device and interco...

This paper studies buffer block planning for interconnect-driven floorplanning in deep submicron designs. We first introduce the concept of feasible region (FR) for buffer insertion, and derive closed-form formula for FR. We observe that the FR for a buffer is quite large in general even under fairly tight delay constraint. Therefore, FR gives us a lot of flexibility to plan for buffer locations. We then develop an effective buffer block planning (BBP) algorithm to perform buffer clustering such that the overall chip area and the buffer block number can be minimized. To the best of our knowledge, this is the first in-depth study on buffer planning for interconnect-driven floorplanning with both area and delay consideration.

Interconnect has become the dominating factor in determining circuit performance and reliability in deep submicron designs. In this embedded tutorial, we first discuss the trends and challenges of interconnect design as the technology feature size rapidly decreases towards below 0.1 micron. Then, we present commonly used interconnect models and a set of interconnect design and optimization techniques for improving interconnect performance and reliability. Finally, we present comparisons of different optimization techniques in terms of their efficiency and optimization results, and show the impact of these optimization techniques on interconnect performance in each technology generation from the 0.35µm to 0.07µm projected in the National Technology Roadmap for Semiconductors.

As the IC devices is scaled into nanometer dimen- sions and operates in giga-hertz frequencies, interconnect design and optimization have become critical in determining the system performance and reliability.

Buffer insertion has successfully been applied to reduce delay in global interconnect paths; however, existing techniques only optimize delay and timing slack. With the increasing ratio of coupling to total capacitance and the use of aggressive dynamic logic circuit families, noise is becoming a major design bottleneck. We present comprehensive buffer insertion techniques for noise and delay optimization. Our experiments on a microprocessor design show that our approach fixes all noise violations that were identified by a detailed, simulation-based noise analysis tool. Further, we show that the performance penalty induced by optimizing both delay and noise as opposed to only delay is 2%. 1.

This paper presents an e cient algorithm for buffered Steiner tree construction with wire sizing. Given a source and n sinks of a signal net, with given positions and a required arrival time associated with each sink, the algorithm finds a Steiner tree with buffer insertion and wire sizing so that the required arrival time (or timing slack) at the source is maximized. The unique contribution of our algorithm is that it performs Steiner tree construction, buffer insertion, and wire sizing simultaneously with consideration of both critical delay and total capacitance minimization by combining the performance-driven A-tree construction and dynamic programming based buffer insertion and wire sizing, while tree construction and the other delay minimization techniques were carried out independently in the past. Experimental results show the effectiveness of our approach.

this paper, we study the optimal wiresizing problem for nets with multiple sources under the RC tree model and the Elmore delay model. We decompose the routing tree for a multisource net into the source subtree (SST) and a set of loading subtrees (LSTs), and show that the optimal wiresizing solution satisfies a number of interesting properties, including: the LST separability, the LST monotone property, the SST local monotone property, and the dominance property. Furthermore, we study the optimal wiresizing problem using a variable segment-division rather than an a priori fixed segment-division as in all previous works and reveal the bundled refinement property. These properties lead to efficient algorithms to compute the optimal solutions. We have tested our algorithm on nets extracted from the multilayer layout for a high-performance Intel microprocessor. Accurate SPICE simulation shows that our methods reduce the average delay by up to 23.5% and the maximum delay by up to 37.8%, respectively, for the submicron CMOS technology when compared to the minimal wire width solution. In addition, the algorithm based on the variable segment-division yields a speedup of over 1003 time and does not lose any accuracy, when compared with the algorithm based on the a priori fixed segment-division

As technology scales, interconnect-centric design flows become imperative for achieving timing closure. Preplanning buffers and wires in the layout is critical for such flows. Both buffers and wires must be considered simultaneously, since wire routes determine buffer requirements and buffer locations constrain the wire routes. In contrast to recently proposed buffer-block planning approaches, our novel design methodology distributes a set of buffer sites throughout the design. This allows one to use a tile graph to abstract the buffer planning problem and simultaneously address wire planning. We present a four-stage heuristic called resource allocation for buffer and interconnect distribution for resource allocation that includes a new, efficient technique for buffer insertion using a length-based constraint. Extensive experiments validate the effectiveness of this approach.

This paper reports two sets of important results in our exploration of an interconnect-centric design methodology for deep submicron (DSM) designs: (I) We obtain a set of efficient, accurate performance and area estimation models for optimal wire sizing (OWS) using two simple wire sizing schemes, namely single-width sizing (1-WS) and two-width sizing (2-WS). These simple, efficient estimation models enable us to explore the trade-off between delay and area of interconnect designs. They also enable high level design tools to consider interconnect layout optimization during design planning. (II) Guided by our interconnect estimation models, we study the interconnect architecture planning problem for wire-width designs. We achieve a rather surprising result which suggests that two pre-determined wire widths per metal layer are sufficient to achieve near-optimal performance for current and future technologies from 0.25m to 0.07m generations.. This result will greatly simplify the routing architecture and routing tools for DSM designs. We believe that our interconnect estimation and planning results will have a significant impact to guide high-performance DSM designs.