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Active-feedback frequency-compensation technique for low-power multistage amplifiers
- IEEE J. Solid-State Circuits
, 2003
"... technique for low-power operational amplifiers is presented in this paper. With an active-feedback mechanism, a high-speed block separates the low-frequency high-gain path and high-frequency signal path such that high gain and wide bandwidth can be achieved simultaneously in the AFFC amplifier. The ..."
Abstract
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Cited by 7 (3 self)
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technique for low-power operational amplifiers is presented in this paper. With an active-feedback mechanism, a high-speed block separates the low-frequency high-gain path and high-frequency signal path such that high gain and wide bandwidth can be achieved simultaneously in the AFFC amplifier. The gain stage in the active-feedback network also reduces the size of the compensation capacitors such that the overall chip area of the amplifier becomes smaller and the slew rate is improved. Furthermore, the presence of a left-half-plane zero in the proposed AFFC topology improves the stability and settling behavior of the amplifier. Three-stage amplifiers based on AFFC and nested-Miller compensation (NMC) techniques have been implemented by a commercial 0.8- m CMOS process. When driving a 120-pF capacitive load, the AFFC amplifier achieves over 100-dB dc gain, 4.5-MHz gain-bandwidth product (GBW) , 65 phase margin, and 1.5-V / s average slew rate, while only dissipating 400- W power at a 2-V supply. Compared to a three-stage NMC amplifier, the proposed AFFC amplifier provides improvement in both the GBW and slew rate by 11 times and reduces the chip area by 2.3 times without significant increase in the power consumption. Index Terms—Active feedback, active-capacitive-feedback network, amplifiers, frequency compensation, multistage amplifiers.
Modeling Technology Impact on Cluster Microprocessor Performance
- IEEE Trans. VLSI Systems
, 2003
"... Abstract—The growing speed gap between transistors and wire interconnects is forcing the development of distributed, or clustered, architectures. These designs partition the chip into small regions with fast intracluster communication. Longer latency is required to communicate between clusters. The ..."
Abstract
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Cited by 5 (3 self)
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Abstract—The growing speed gap between transistors and wire interconnects is forcing the development of distributed, or clustered, architectures. These designs partition the chip into small regions with fast intracluster communication. Longer latency is required to communicate between clusters. The hardware and/or software are responsible for scheduling instructions to clusters such that critical path communication occurs within a cluster. This paper presents GENEric SYstems Simulator (GENESYS), a technology modeling tool that captures a broad range of materials, device, circuit, and interconnect parameters across current and future semiconductor technology. This tool is used to explore the relationship between key technology parameters (intercluster wire delay and transistor switching delay) and key architecture parameters (superscalar versus multithreaded instruction dispatch, and value prediction support). GENESYS is used to predict intercluster latencies as VLSI technology advances. The study provides quantitative data showing how conventional superscalar performance is degraded with increasing wire latency. Threaded designs are more tolerant to wire delay. Optimal thread size changes with advancing VLSI technology, suggesting a highly adaptive architecture. Value prediction is shown to be useful in all cases, but provides more benefit to the multithreaded design. Index Terms—Clustered microprocessor, performance analysis, technology modeling. I.

