Variability in digital integrated circuits makes timing verification an extremely challenging task. In this paper, a canonical first order delay model is proposed that takes into account both correlated and independent randomness. A novel linear-time block-based statistical timing algorithm is employed to propagate timing quantities like arrival times and required arrival times through the timing graph in this canonical form. At the end of the statistical timing, the sensitivities of all timing quantities to each of the sources of variation are available. Excessive sensitivities can then be targeted by manual or automatic optimization methods to improve the robustness of the design. The statistical timing analysis is incremental, and is therefore suitable for use in the inner loop of physical synthesis or other optimization programs. The second novel contribution of this paper is the computation of local and global criticality probabilities. For a very small cost in CPU time, the probability of each edge or node of the timing graph being critical is computed. These criticality probabilities provide additional useful diagnostics to synthesis, optimization, test generation and path enumeration programs. Numerical results are presented on industrial ASIC chips with over two million logic gates. 1.

Abstract — Variability in the chip design process has been relatively increasing with technology scaling to smaller dimensions. Using worst case analysis for circuit optimization severely over-constrains the system and results in solutions with excessive penalties. Statistical timing analysis and optimization have consequently emerged as a refinement of the traditional static timing approach for circuit design optimization. In this paper, we propose a statistical gate sizing methodology for timing yield improvement. We build statistical models for gate delays from library characterizations at multiple process corners and operating conditions. Statistical timing analysis is performed, which drives gate sizing for timing yield optimization. Experimental results are reported for the ISCAS and MCNC benchmarks. In addition, we provide insight into statistical properties of gate delays for a given technology library which intuitively explains when and why statistical optimization improves over static timing optimization. I.

Abstract — Process variations are of increasing concern in today’s technologies, and can significantly affect circuit performance. We present an efficient statistical timing analysis algorithm that predicts the probability distribution of the circuit delay considering both inter-die and intra-die variations, while accounting for the effects of spatial correlations of intra-die parameter variations. The procedure uses a first-order Taylor series expansion to approximate the gate and interconnect delays. Next, principal component analysis techniques are��and ��� are employed to transform the set of correlated parameters into an uncorrelated set. The statistical timing computation is then easily performed with a PERT-like circuit graph traversal. The run-time of our algorithm is linear in the number of gates and interconnects, as well as the number of varying parameters and grid partitions that are used to model spatial correlations. The accuracy of the method is verified with Monte Carlo simulation. On average, for 100nm technology, the errors of mean and standard deviation values computed by the proposed method respectively, and the errors of predicting the��and confidence point are ���and ���respectively. A testcase with about 17,800 gates was solved in about�seconds, with high accuracy as compared to a Monte Carlo simulation that required more than�hours.

Abstract — As technology scales into the sub-90nm domain, manufacturing variations become an increasingly significant portion of circuit delay. As a result, delays must be modeled as statistical distributions during both analysis and optimization. This paper uses incremental, parametric statistical static timing analysis (SSTA) to perform gate sizing with a required yield target. Both correlated and uncorrelated process parameters are considered by using a first-order linear delay model with fitted process sensitivities. The fitted sensitivities are verified to be accurate with circuit simulations. Statistical information in the form of criticality probabilities are used to actively guide the optimization process which reduces run-time and improves area and performance. The gate sizing results show a significant improvement in worst slack at 99.86 % yield over deterministic optimization. I.

The impact of parameter variations on timing due to process and environmental variations has become significant in recent years. With each new technology node this variability is becoming more prominent. In this work, we present a general Statistical Timing Analysis (STA) framework that captures spatial correlations between gate delays. Our technique does not make any assumption about the distributions of the parameter variations, gate delay and arrival times. We propose a Taylor-series expansion based polynomial representation of gate delays and arrival times which is able to e#ectively capture the non-linear dependencies that arise due to increasing parameter variations. In order to reduce the computational complexity introduced due to polynomial modeling during STA, we propose an e#cient linear-modeling driven polynomial STA scheme. On an average the degree-2 polynomial scheme had a 7.3x speedup as compared to Monte Carlo with 0.049 units of rms error w.r.t Monte Carlo. Our technique is generic and can be applied to arbitrary variations in the underlying parameters.

Recent study shows that the existing first order canonical timing model is not sufficient to represent the dependency of the gate delay on the variation sources when processing and operational variations become more and more significant. Due to the nonlinearity of the mapping from variation sources to the gate/wire delay, the distribution of the delay is no longer Gaussian even if the variation sources are normally distributed. Anovelquadratic timing model is proposed to capture the non-linearity of the dependency of gate/wire delays and arrival times on the variation sources. Systematic methodology is also developed to evaluate the correlation and distribution of the quadratic timing model. Based on these, a novel statistical timing analysis algorithm is propose which retains the complete correlation information during timing analysis and has the same computation complexity as the algorithm based on the canonical timing model. Tested on the ISCAS circuits, the proposed algorithm shows 10 × accuracy improvement over the existing first order algorithm while no significant extra runtime is needed.

The large-scale process and environmental variations for today’s nanoscale ICs are requiring statistical approaches for timing analysis and optimization. Significant research has been recently focused on developing new statistical timing analysis algorithms, but often without consideration for how one should interpret the statistical timing results for optimization. In this paper [1] we demonstrate why the traditional concepts of slack and critical path become ineffective under large-scale variations, and we propose a novel sensitivity-based metric to assess the “criticality ” of each path and/or arc in the statistical timing graph. We define the statistical sensitivities for both paths and arcs, and theoretically prove that our path sensitivity is equivalent to the probability that a path is critical, and our arc sensitivity is equivalent to the probability that an arc sits on the critical path. An efficient algorithm with incremental analysis capability is described for fast sensitivity computation that has a linear runtime complexity in circuit size. The efficacy of the proposed sensitivity analysis is demonstrated on both standard benchmark circuits and large industry examples. 1.

With the increased significance of leakage power and performance variability, the yield of a design is becoming constrained both by power and performance limits, thereby significantly complicating circuit optimization. In this paper, we propose a new optimization method for yield optimization under simultaneous leakage power and performance limits. The optimization approach uses a novel leakage power and performance analysis that is statistical in nature and considers the correlation between leakage power and performance to enable accurate computation of circuit yield under power and delay limits. We then propose a new heuristic approach to incrementally compute the gradient of yield with respect to gate sizes in the circuit with high efficiency and accuracy. We then show how this gradient information can be effectively used by a non-linear optimizer to perform yield optimization. We consider both inter-die and intra-die variations with correlated and random components. The proposed approach is implemented and tested and we demonstrate up to 40 % yield improvement compared to a deterministically optimized circuit. 1.

Statistical static timing analysis (SSTA) has become a key method for analyzing the effect of process variation in aggressively scaled CMOS technologies. Much research has focused on the modeling of spatial correlation in SSTA. However, the vast majority of these works used artificially generated process data to test the proposed models. Hence, it is difficult to determine the actual effectiveness of these methods, the conditions under which they are necessary, and whether they lead to a significant increase in accuracy that warrants their increased runtime and complexity. In this paper, we study 5 different correlation models and their associated SSTA methods using 35420 critical dimension (CD) measurements that were extracted from 23 reticles on 5 wafers in a 130nm CMOS process. Based on the measured CD data, we analyze the correlation as a function of distance and generate 5 distinct correlation models, ranging from simple models which incorporate one or two variation components to more complex models that utilize principle component analysis and Quad-trees. We then study the accuracy of the different models and compare their SSTA results with the result of running STA directly on the extracted data. We also examine the trade-off between model accuracy and run time, as well as the impact of die size on model accuracy. We show that, especially for small dies (< 6.6mm x 5.7mm), the simple models provide comparable accuracy to that of the more complex ones, while incurring significantly less runtime and implementation difficulty. The results of this study demonstrate that correlation models for SSTA must be carefully tested on actual process data and must be used judiciously. 1.

Chips manufactured in 90 nm technology have shown large parametric variations, and a worsening trend is predicted. These parametric variations make circuit optimization difficult since different paths are frequency-limiting in different parts of the multi-dimensional process space. Therefore, it is desirable to have a new diagnostic metric for robust circuit optimization. This paper presents a novel algorithm to compute the criticality probability of every edge in the timing graph of a design with linear complexity in the circuit size. Using industrial benchmarks, we verify the correctness of our criticality computation via Monte Carlo simulation. We also show that for large industrial designs with 442,000 gates, our algorithm computes all edge criticalities in less than 160 seconds.