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22
Rationale and challenges for optical interconnects to electronic chips
- Proc. IEEE
, 2000
"... The various arguments for introducing optical interconnections to silicon CMOS chips are summarized, and the challenges for optical, optoelectronic, and integration technologies are discussed. Optics could solve many physical problems of interconnects, including precise clock distribution, system sy ..."
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Cited by 58 (6 self)
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The various arguments for introducing optical interconnections to silicon CMOS chips are summarized, and the challenges for optical, optoelectronic, and integration technologies are discussed. Optics could solve many physical problems of interconnects, including precise clock distribution, system synchronization (allowing larger synchronous zones, both on-chip and between chips), bandwidth and density of long interconnections, and reduction of power dissipation. Optics may relieve a broad range of design problems, such as crosstalk, voltage isolation, wave reflection, impedance matching, and pin inductance. It may allow continued scaling of existing architectures and enable novel highly interconnected or high-bandwidth architectures. No physical breakthrough is required to implement dense optical interconnects to silicon chips, though substantial technological work remains. Cost is a significant barrier to practical introduction, though revolutionary approaches exist that might achieve economies of scale. An Appendix analyzes scaling of on-chip global electrical interconnects, including line inductance and the skin effect, both of which impose significant additional constraints on future interconnects. Keywords—Off-chip wiring, on-chip wiring, optical interconnects, quantum-well modulator, vertical-cavity surface-emitting laser. I.
Scaling Optoelectronic-VLSI Circuits into the 21st Century: A Technology Roadmap
, 1996
"... Technologies now exist for implementing dense surface-normal optical interconnections for silicon CMOS VLSI using hybrid integration techniques. The critical factors in determining the performance of the resulting photonic chip are the yield on the transceiver device arrays, the sensitivity and powe ..."
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Cited by 24 (7 self)
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Technologies now exist for implementing dense surface-normal optical interconnections for silicon CMOS VLSI using hybrid integration techniques. The critical factors in determining the performance of the resulting photonic chip are the yield on the transceiver device arrays, the sensitivity and power dissipation of the receiver and transmitter circuits, and the total optical power budget available. The use of GaAs--AlGaAs multiple-quantum-well p-i-n diodes for on-chip detection and modulation is one effective means of implementing the optoelectronic transceivers. We discuss a potential roadmap for the scaling of this hybrid optoelectronic VLSI technology as CMOS linewidths shrink and the characteristics of the hybrid optoelectronic tranceiver technology improve. An important general conclusion is that, unlike electrical interconnects, such dense optical interconnections directly to an electronic circuit will likely be able to scale in capacity to match the improved performance of futur...
Device Requirements for Optical Interconnects to Silicon Chips
"... Abstract — We examine the current performance and future demands of interconnects to and on silicon chips. We compare electrical and optical interconnects and project the requirements for optoelectronic and optical devices if optics is to solve the major problems of interconnects to future high perf ..."
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Cited by 9 (1 self)
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Abstract — We examine the current performance and future demands of interconnects to and on silicon chips. We compare electrical and optical interconnects and project the requirements for optoelectronic and optical devices if optics is to solve the major problems of interconnects to future high performance silicon chips. Optics has potential benefits in interconnect density, energy and timing. The necessity of low interconnect energy imposes low limits especially on the energy of the optical output devices, with a ~ 10 fJ/bit device energy target emerging. Some optical modulators and radical laser approaches may meet this requirement. Low (e.g., a few fF or less) photodetector capacitance is important. Very compact wavelength splitters are essential for connecting the information to fibers. Dense waveguides are necessary on-chip or on boards for guided wave optical approaches, especially if very high clock rates or dense WDM are to be avoided. Free space optics potentially can handle the necessary bandwidths even without fast clocks or WDM. With such technology, however, optics may enable the continued scaling of interconnect capacity required by future chips. Index Terms—ITRS roadmap, optical interconnections, optical modulators O I.
Prediction model for evaluation of reconfigurable interconnects in distributed shared-memory systems
- Proceedings of the 2005 International Workshop on System Level Interconnect Prediction
, 2005
"... Reconfigurable interconnection networks for distributed shared memory machines exploit properties of the workload dynamics that are not easily captured by statistical traffic models. Therefore, when designing such a network, one should make trade-offs based on full-system simulation for all viable w ..."
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Cited by 7 (5 self)
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Reconfigurable interconnection networks for distributed shared memory machines exploit properties of the workload dynamics that are not easily captured by statistical traffic models. Therefore, when designing such a network, one should make trade-offs based on full-system simulation for all viable workloads. It is however very time-consuming to do such simulations. In this paper, we present a technique that can predict the performance of a machine for different network parameters, based on the results of only one full simulation run. We also define confidence intervals for our prediction, and analyze the impact of several assumptions that were made.
Traffic temporal analysis for reconfigurable interconnects in shared-memory systems
- in Proceedings of the 19th IEEE International Parallel & Distributed Processing Symposium
, 2005
"... New advances in reconfigurable optical interconnect technologies will allow the fabrication of cheap, fast and run-time adaptable networks for connecting processors and memory modules in large shared-memory multiprocessor machines. Since, in some technologies, the switching times of these components ..."
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Cited by 7 (4 self)
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New advances in reconfigurable optical interconnect technologies will allow the fabrication of cheap, fast and run-time adaptable networks for connecting processors and memory modules in large shared-memory multiprocessor machines. Since, in some technologies, the switching times of these components are high compared to the memory access time, reconfiguration can only take place on a time scale significantly above individual memory accesses. In this paper, we present preliminary results of our investigation into the exploitability of the space and time locality of address streams by a reconfigurable network. 1.
Design and Construction of an Optoelectronic Crossbar Switch Containing a Terabit per Second Free Space Optical Interconnect
- IEEE Journal of Selected Topics in Quantum Electronics, Vol.5, No.2
, 1999
"... The completed detailed design and initial phases of construction of an optoelectronic crossbar demonstrator are presented. The experimental system uses hybrid very large scale integrated optoelectronics technology whereby InGaAs-based detectors and modulators are flip-chip bonded onto silicon integr ..."
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Cited by 5 (2 self)
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The completed detailed design and initial phases of construction of an optoelectronic crossbar demonstrator are presented. The experimental system uses hybrid very large scale integrated optoelectronics technology whereby InGaAs-based detectors and modulators are flip-chip bonded onto silicon integrated circuits. The system aims to demonstrate (a 1-Tb/s aggregate data input/output to a single chip by means of freespace optics.
Time Domain Modeling of Lossy Interconnects
- IEEE Transactions on Advanced Packaging
, 2001
"... A new model for dielectric loss, suitable for time domain modeling of printed circuit boards, is proposed. The model is based on a physical relaxation model. Complete time domain modeling of skin effect and dielectric losses in FR-4 boards are demonstrated and experimentally verified. Finally, the d ..."
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Cited by 4 (2 self)
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A new model for dielectric loss, suitable for time domain modeling of printed circuit boards, is proposed. The model is based on a physical relaxation model. Complete time domain modeling of skin effect and dielectric losses in FR-4 boards are demonstrated and experimentally verified. Finally, the developed model is used to predict that FR-4 boards are useful for data rates up to 10 Gb/s. Index terms.
Electronic design issues in high-bandwidth parallel optical interfaces to VLSI circuits
, 1999
"... ...................................................................................................................................... viii List of publications .......................................................................................................................ix Chapter 1: Introd ..."
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Cited by 2 (1 self)
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...................................................................................................................................... viii List of publications .......................................................................................................................ix Chapter 1: Introduction..................................................................................................................1 1.1 Scope and overall research contribution..............................................................................1 1.2 Motivation............................................................................................................................2 1.2.1 The interconnect problem .............................................................................................2 1.2.2 Capabilities and limitations of electrical interconnects................................................4 1.2.3 Advantages of optical interconnects ......................................
Connectivity Models for Optoelectronic Computing Systems
- Proceedings of the 14th International Parallel and Distributed Processing Symposium, Workshop on Optics and Computer Science
"... Abstract. Rent's rule and related concepts of connectivity such asdimensionality, line-length distributions, and separators have found great use in fundamental studies of di erent interconnection media, including superconductors and optics, as well as the study of optoelectronic computing systems. I ..."
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Cited by 2 (1 self)
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Abstract. Rent's rule and related concepts of connectivity such asdimensionality, line-length distributions, and separators have found great use in fundamental studies of di erent interconnection media, including superconductors and optics, as well as the study of optoelectronic computing systems. In this paper generalizations for systems for which the Rent exponent is not constan tthroughout the interconnection hierarchy are pro vided. The origin of Rent's rule is stressed as resulting from the embedding of a high-dimensional information ow graph to two- or three-dimensional physical space. The applicability of these traditionally solid-wire-based concepts to free-space optically interconnected systems is discussed. 1 Connectivity,Dimensionality,and Rent's Rule The importance of wiring models has long been recognized and they have been used not only for design purposes but also for the fundamental study of interconnections and communication in computing. A central and ubiquitous concept
Traffic pattern analysis for reconfigurable interconnects in shared-memory systems
- In Proceedings of the 15th ProRISC Workshop
, 2004
"... Abstract — New advances in reconfigurable optical interconnect technologies will allow the fabrication of cheap, fast and run-time adaptable networks for connecting processors and memory modules in large shared-memory multiprocessor machines. Since the switching times of these components are typical ..."
Abstract
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Cited by 1 (1 self)
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Abstract — New advances in reconfigurable optical interconnect technologies will allow the fabrication of cheap, fast and run-time adaptable networks for connecting processors and memory modules in large shared-memory multiprocessor machines. Since the switching times of these components are typically high compared to the memory access time, reconfiguration can only take place on a time scale significantly above individual memory accesses. In this paper, we present preliminary results of our investigation into the exploitability of the space and time locality of address streams by a reconfigurable network.

