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A 1.5-V, 10-bit, 14.3-MS/s CMOS Pipeline Analog-to-Digital Converter
"... A 1.5-V, 10-bit, 14.3-MS/s pipeline analog-to-digital converter was implemented in a 0.6-m CMOS technology. Emphasis was placed on observing device reliability constraints at low voltage. MOS switches were implemented without lowthreshold devices by using a bootstrapping technique that does not subj ..."
Abstract
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A 1.5-V, 10-bit, 14.3-MS/s pipeline analog-to-digital converter was implemented in a 0.6-m CMOS technology. Emphasis was placed on observing device reliability constraints at low voltage. MOS switches were implemented without lowthreshold devices by using a bootstrapping technique that does not subject the devices to large terminal voltages. The converter achieved a peak signal-to-noise-and-distortion ratio of 58.5 dB, maximum differential nonlinearity of 0.5 least significant bit (LSB), maximum integral nonlinearity of 0.7 LSB, and a power consumption of 36 mW. Index Terms---Analog to digital, low voltage, reliability. I. INTRODUCTION I N mixed-mode analog-to-digital (A/D) interfaces, there are many applications where a video-rate A/D converter (ADC) is integrated with complex digital signal-processing (DSP) blocks in a compatible, low-cost technology---particularly CMOS. Such applications include camcorders, wireless localarea -network transceivers, and digital set-top boxes. Ad...
Determining and Quantifying Interconnect Parameters
"... Introduction 4.2 A First Glance 4.3 Interconnect Parameters --- Capacitance, Resistance, and Inductance 4.3.1 Capacitance 4.3.2 Resistance 4.3.3 Inductance 4.4 Electrical Wire Models 4.4.1 The Ideal Wire 4.4.2 The Lumped Model 4.4.3 The Lumped RC model 4.4.4 The Distributed rc Line 4.4.5 ..."
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Introduction 4.2 A First Glance 4.3 Interconnect Parameters --- Capacitance, Resistance, and Inductance 4.3.1 Capacitance 4.3.2 Resistance 4.3.3 Inductance 4.4 Electrical Wire Models 4.4.1 The Ideal Wire 4.4.2 The Lumped Model 4.4.3 The Lumped RC model 4.4.4 The Distributed rc Line 4.4.5 The Transmission Line 4.5 SPICE Wire Models 4.5.1 Distributed rc Lines in SPICE 4.5.2 Transmission Line Models in SPICE 4.6 Perspective: A Look into the Future chapter4.fm Page 103 Monday, September 6, 1999 1:44 PM 104 THE WIRE Chapter 4 4.1Introduction Throughout most of the past history of integrated circuits, on-chip interconnect wires were considered to be second class citizens that had only to be considered in special cases or when performing high-precision analysis. With the introduction of deep-submicron semiconductor technologies, this picture is undergoing rapid changes. The parasitics effects introduced by the wires displ

