This paper presents a comprehensive survey of existing techniques for interconnect optimization during the VLSI physical design process, with emphasis on recent studies on interconnect design and optimization for high-performance VLSI circuit design under the deep submicron fabrication technologies. First, we present a number of interconnect delay models and driver/gate delay models of various degrees of accuracy and efficiency which are most useful to guide the circuit design and interconnect optimization process. Then, we classify the existing work on optimization of VLSI interconnect into the following three categories and discuss the results in each category in detail: (i) topology optimization for highperformance interconnects, including the algorithms for total wire length minimization, critical path length minimization, and delay minimization; (ii) device and interconnect sizing, including techniques for efficient driver, gate, and transistor sizing, optimal wire sizing, and simultaneous topology construction, buffer insertion, buffer and wire sizing; (iii) highperfbrmance clock routing, including abstract clock net topology generation and embedding, planar clock routing, buffer and wire sizing for clock nets, non-tree clock routing, and clock schedule optimization. For each method, we discuss its effectiveness, its advantages and limitations, as well as its computational efficiency. We group the related techniques according to either their optimization techniques or optimization objectives so that the reader can easily compare the quality and efficiency of different solutions.

This paper studies buffer block planning for interconnect-driven floorplanning in deep submicron designs. We first introduce the concept of feasible region (FR) for buffer insertion, and derive closed-form formula for FR. We observe that the FR for a buffer is quite large in general even under fairly tight delay constraint. Therefore, FR gives us a lot of flexibility to plan for buffer locations. We then develop an effective buffer block planning (BBP) algorithm to perform buffer clustering such that the overall chip area and the buffer block number can be minimized. To the best of our knowledge, this is the first in-depth study on buffer planning for interconnect-driven floorplanning with both area and delay consideration.

Interconnect has become the dominating factor in determining circuit performance and reliability in deep submicron designs. In this embedded tutorial, we first discuss the trends and challenges of interconnect design as the technology feature size rapidly decreases towards below 0.1 micron. Then, we present commonly used interconnect models and a set of interconnect design and optimization techniques for improving interconnect performance and reliability. Finally, we present comparisons of different optimization techniques in terms of their efficiency and optimization results, and show the impact of these optimization techniques on interconnect performance in each technology generation from the 0.35µm to 0.07µm projected in the National Technology Roadmap for Semiconductors.

As the IC devices is scaled into nanometer dimen- sions and operates in giga-hertz frequencies, interconnect design and optimization have become critical in determining the system performance and reliability.

this paper, we study the optimal wiresizing problem for nets with multiple sources under the RC tree model and the Elmore delay model. We decompose the routing tree for a multisource net into the source subtree (SST) and a set of loading subtrees (LSTs), and show that the optimal wiresizing solution satisfies a number of interesting properties, including: the LST separability, the LST monotone property, the SST local monotone property, and the dominance property. Furthermore, we study the optimal wiresizing problem using a variable segment-division rather than an a priori fixed segment-division as in all previous works and reveal the bundled refinement property. These properties lead to efficient algorithms to compute the optimal solutions. We have tested our algorithm on nets extracted from the multilayer layout for a high-performance Intel microprocessor. Accurate SPICE simulation shows that our methods reduce the average delay by up to 23.5% and the maximum delay by up to 37.8%, respectively, for the submicron CMOS technology when compared to the minimal wire width solution. In addition, the algorithm based on the variable segment-division yields a speedup of over 1003 time and does not lose any accuracy, when compared with the algorithm based on the a priori fixed segment-division

This paper presents an efficient approach to perform global interconnect sizing and spacing (GISS) for multiple nets to minimize interconnect delays with consideration of coupling capacitance, in addition to area and fringing capacitances. We introduce the formulation of symmetric and asymmetric wire sizing and spacing. We prove two important results on the symmetric and asymmetric effective-fringing properties which leadtoavery effective bound computation algorithm to compute the upper and lower bounds of the optimal wire sizing and spacing solution for all nets under consideration. Our experiments show that in most cases the upper and lower bounds meet quickly after a few iterations and we actually obtain the optimal solution. To our knowledge, this is the first in-depth study of global wire sizing and spacing for multiple nets with consideration of coupling capacitance. Experimental results show that our GISS solutions lead to substantial delay reduction than existing single net wire-sizing solutions without consideration of coupling capacitance.

During the routing of global interconnects, macro blocks form useful routing regions which allow wires to go through but forbid buffers to be inserted. They give restrictions on buffer locations. In this paper, we take these buffer location restrictions into consideration and solve the simultaneous maze routing and buffer insertion problem. Given a block placement defining buffer location restrictions and a pair of pins (a source and a sink), we give a polynomial time exact algorithm to find a buffered route from the source to the sink with minimum Elmore delay.

In this paper we present a repeater block planning algorithm forinterconnect-centric floorplanning. We introduce the concept of

To implement high-performance global interconnect without impacting the performance of existing blocks, the use of buffer blocks is increasingly popular in structured-custom and block-based ASIC/SOC methodologies. Recent works by Cong et al. [6] and Tang and Wong [25] give algorithms to solve the buffer block planning problem. In this paper we address the problem of how to perform buffering of global nets given an existing buffer block plan. Assuming as in [6, 25] that global nets have been already decomposed into two-pin connections, we give a provably good algorithm based on a recent approach of Garg and Könemann [8] and Fleischer [7]. Our method routes connections using available buffer blocks, such that required upper and lower bounds on buffer intervals – as well as wirelength upper bounds per connection – are satisfied. Unlike [6, 25], our model allows more than one buffer to be inserted into any given connection. In addition, our algorithm observes buffer parity constraints, i.e., it will choose to use an inverter or a buffer ( = co-located pair of inverters) according to source and destination signal parity. The algorithm outperforms previous approaches [6] and has been validated on top-level layouts extracted from a recent high-end microprocessor design. 1

This paper presents a set of interconnect performance estimation models for design planning with consideration of various effective interconnect layout optimization techniques, including optimal wire sizing, simultaneous driver and wire sizing, and simultaneous buffer insertion/sizing and wire sizing. These models are extremely efficient, yet provide high degree of accuracy. They have been tested on a wide range of parameters and shown to have over 90% accuracy on average compared to running best-available interconnect layout optimization algorithms directly. As a result, these fast yet accurate models can be used efficiently during high-level design space exploration, interconnect-driven design planning/synthesis, and timing-driven placement to ensure design convergence for deep submicrometer designs.