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Thermal Via Allocation for 3D ICs Considering Temporally and Spatially Variant Thermal Power
by Hao Yu Member, Yiyu Shi, Lei He Member, Tanay Karnik, Senior Member
…Thermal Via Allocation for 3D ICs Considering Temporally and Spatially Variant Thermal Power Hao…
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Thermal via allocation for 3D ICs considering temporally and spatially variant thermal power
by Hao Yu, Yiyu Shi, Lei He — 2006 — in Proc. Int. Symp. on Low Power Electronics and Design (ISLPED
…Thermal Via Allocation for 3D ICs Considering Temporally and Spatially Variant Thermal Power…
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