Searching for authors named "Michael Mayer" – sorted by Relevance.

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12 documents found, showing 1 through 10. Next 10 →

COMPLETE SET OF PIEZORESISTIVE COEFFICIENTS OF CMOS n + -Diffusion
by Michael Mayer, Oliver Paul, Henry Baltes
…COMPLETE SET OF PIEZORESISTIVE COEFFICIENTS OF CMOS n+ -DIFFUSION Michael Mayer, Oliver Paul…
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In-situ Measurement of Stress and Temperature under Bonding Pads During Wire Bonding Using Integrated Microsensors
by Michael Mayer, Oliver Paul, Henry Baltes — 1998 — Proc. 2nd Int. Conf. Emerging Microelectr. and Interconn. Technol. EMIT’98
… Integrated Microsensors Michael Mayer, Oliver Paul, and Henry Baltes Physical Electronics Laboratory, ETH…
Cited by 4 (4 self) – Add To MetaCart

Integrated temperature microsensors for Characterization and optimization of. . .
by Michael Mayer, Oliver Paul, Daniel Bolliger, Henry Baltes — 1999 — IEEE Trans. Comp. Packaging Technol
… Bonding Process Michael Mayer 1 , Oliver Paul 2 , Daniel Bolliger 3 , and Henry Baltes 1 1 Physical…
Cited by 5 (4 self) – Add To MetaCart

In-Situ Calibration of Wire Bonder Ultrasonic System using Integrated Microsensor
by Michael Mayer, Oliver Paul, Daniel Bolliger, Henry Baltes — 1998 — Proc. 2nd IEEE Electr. Packaging Technol. Conf. EPTC’98, Singapore
…In-Situ Calibration Of Wire Bonder Ultrasonic System Using Integrated Microsensor Michael Mayer…
Cited by 3 (3 self) – Add To MetaCart

Case study: Visual analysis of complex, time-dependent simulation results of a diesel exhaust system
by Helmut Doleisch, Michael Mayer, Martin Gasser, Helwig Hauser — 2004 — In Proc. of the 6th Joint IEEE TCVG - EUROGRAPHICS Symposium on Visualization (VisSym 2004
… Diesel Exhaust System Helmut Doleisch 1 , Michael Mayer 1 , Martin Gasser 1 , Roland Wanker 2 , Helwig…
Cited by 20 (11 self) – Add To MetaCart

Biographies
by Michael Mayer Received, Michael Mayer, Juerg Schwizer, Daniel Bolliger, Oliver Paul, Juergen Steinbichler — 2001
…ACTIVE TEST CHIPS FOR IN SITU WIRE BONDING PROCESS CHARACTERISATION Michael Mayer, Juerg Schwizer…
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T1x1.3/98-007 1
by Contribution To Standards, Michael Mayer
… Requirements STANDARDS PROJECT: T1X1.3 Working Group AUTHOR: Michael Mayer SOURCE: CONTACT: M. Mayer PO Box 402…
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In-Situ Ultrasonic Stress Measurements During Ball Bonding using Integrated Piozoresistive Microsensors
by Michael Mayer, Jÿrg Schwizer, Oliver Paul, Daniel Bolliger, Henry Baltes — 1999 — Proc. 1999 Intersociety Electron. Pack. Conf. (InterPACK99), Maui
… MICROSENSORS Michael Mayer, JŸrg Schwizer, Oliver Paul*, Daniel Bolliger & , and Henry Baltes ABSTRACT Stress…
Cited by 6 (6 self) – Add To MetaCart

Thermosonic Ball Bonding: Friction Model Based On Integrated Microsensor Measurements
by Jürg Schwizer, Michael Mayer, Daniel Bolliger, Oliver Paul, Henry Baltes — 1999 — Proc. 24th IEEE/CPMT Intl. ElecTechnical Programmes of SEMICON Singapore 7-11 May, 2001 25 Advanced Packaging Technologies Seminar I, May 9, 2001 Manufacturing Technology Symposium IEMT’99
… Schwizer 1) , Michael Mayer 1) , Daniel Bolliger 2) , Oliver Paul 3) , Henry Baltes 1) 1) Physical…
Cited by 3 (3 self) – Add To MetaCart

Interactive feature specification for simulation data on time-varying grids
by Helmut Doleisch, Michael Mayer, Martin Gasser, Peter Priesching, Helwig Hauser — 2005 — In Conference on Simulation and Visualization 2005 (SimVis 2005
… Michael Mayer 1 Martin Gasser 1 Peter Priesching 2 Helwig Hauser 1 1 VRVis Research Center, Vienna…
Cited by 14 (5 self) – Add To MetaCart

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