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COMPLETE SET OF PIEZORESISTIVE COEFFICIENTS OF CMOS n + -Diffusion
by Michael Mayer, Oliver Paul, Henry Baltes
…The piezoresistive behavior of n + -diffusions in monocrystalline CMOS-processed silicon is calibrated by independent measurements of the three piezoresistive p-coeffi- cients. These are obtained by subjecting integrated resistors on test chips to three distinct stress fields, (a) using a four-po…
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In-situ Measurement of Stress and Temperature under Bonding Pads During Wire Bonding Using Integrated Microsensors
by Michael Mayer, Oliver Paul, Henry Baltes — 1998 — Proc. 2nd Int. Conf. Emerging Microelectr. and Interconn. Technol. EMIT’98
…: The quality of wire bond connections depends sensitively on process conditions determined by the machine settings of the wire bonder. We report a direct measurement method for the in-process and in-situ monitoring of physical parameters during ball bonding. We use test chips containing microsensor…
Cited by 4 (4 self) – Add To MetaCart

Integrated temperature microsensors for Characterization and optimization of. . .
by Michael Mayer, Oliver Paul, Daniel Bolliger, Henry Baltes — 1999 — IEEE Trans. Comp. Packaging Technol
…A novel ball bond process optimization method based on a thermal signal from an integrated aluminum microsensor is reported. The in-situ temperature during the ball bonding is measured and analyzed. The ultrasonic period shows distinct features corresponding to the scrubbing of the ball on the pad a…
Cited by 5 (4 self) – Add To MetaCart

In-Situ Calibration of Wire Bonder Ultrasonic System using Integrated Microsensor
by Michael Mayer, Oliver Paul, Daniel Bolliger, Henry Baltes — 1998 — Proc. 2nd IEEE Electr. Packaging Technol. Conf. EPTC’98, Singapore
…Based on investigations with an ESEC thermosonic wire bonder, we report a novel ultrasound calibration method which consists of measuring in-situ the friction heat generated by the gold ball as it scrubs on the oxide of an integrated microsensor. This procedure can be carried out in-process using a …
Cited by 3 (3 self) – Add To MetaCart

In-Situ Ultrasonic Stress Measurements During Ball Bonding using Integrated Piozoresistive Microsensors
by Michael Mayer, Jÿrg Schwizer, Oliver Paul, Daniel Bolliger, Henry Baltes — 1999 — Proc. 1999 Intersociety Electron. Pack. Conf. (InterPACK99), Maui
…Stress induced by ultrasonic dissipation during thermosonic ball bond formation is measured in-situ using microsensors integrated below test bonding pads. The devices are fabricated using a commercial CMOS process, exploiting p diffusion as piezoresis-tive sensing material. We report time-dependent …
Cited by 6 (6 self) – Add To MetaCart

Thermosonic Ball Bonding: Friction Model Based On Integrated Microsensor Measurements
by Jürg Schwizer, Michael Mayer, Daniel Bolliger, Oliver Paul, Henry Baltes — 1999 — Proc. 24th IEEE/CPMT Intl. ElecTechnical Programmes of SEMICON Singapore 7-11 May, 2001 25 Advanced Packaging Technologies Seminar I, May 9, 2001 Manufacturing Technology Symposium IEMT’99
…A model of friction during thermosonic ball bonding is reported. It is based on recent ultrasonic stress measurements during ball bonding using piezoresistive microsensors integrated below test bonding pads. At the bonding pad, the microsensor signal is a measure for the stress caused by periodic os…
Cited by 3 (3 self) – Add To MetaCart

IEEE JOURNAL OF QUANTUM ELECTRONICS, VOL. 30, NO. 11. NOVEMBER 1994 Planar Distance and Velocity Sensor
by Rg Kramer Student, Jrg Kramer, Student Member, Peter Seitz, Henry Baltes
…A planar distance and velocity sensor based on a hybrid combination of a light source and a single CMOS photodetector/analog/digital chip is presented. The specific shape of the photodetector calculates a nonlinear geometrical correction purely optically. Hence, electronic data processing is reduced…
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CMOS Integrated Organic Ciliary Actuator Array as a General-Purpose Micromanipulation Tool for Small Objects
by John W. Suh, R. Bruce Darling, Karl F. Böhringer, Bruce R. Donald, Henry Baltes, Gregory T. A. Kovacs — 1999 — Journal of Microelectromechanical Systems
…The #rst micromachined bimorph organic ciliary array with on-chip CMOS circuitry is presented. This ciliary array is composed of an 8 # 8 array of cells each having four orthogonally oriented actuators in an overall die size of 9:4 # 9:4mm 2 . The polyimide based actuators were fabricated directly…
Cited by 4 (0 self) – Add To MetaCart

CMOS Integrated Ciliary Actuator Array as a General-Purpose Micromanipulation Tool for Small Objects
by John W. Suh, R. Bruce Darling, Karl-f. Böhringer, Bruce R. Donald, Henry Baltes, Gregory T. A. Kovacs — 1999 — IEEE Journal of Microelectromechancal Systems
…The first micromachined bimorph organic ciliary array with on-chip CMOS circuitry is presented. This ciliary array is composed of an 8 2 8 array of cells each having four orthogonally oriented actuators in an overall die size of 9.4 2 9.4 mm. The polyimide-based actuators were fabricated directl…
Cited by 5 (2 self) – Add To MetaCart

Cmos Integrated Organic Ciliary Actuator Arrays For General-Purpose Micromanipulation Tasks
by John Suh Bruce, John W. Suh, R. Bruce Darling, Karl F. Bohringer, Bruce R. Donald, Henry Baltes, Gregory T. A. Kovacs — 1999 — Journal of Microelectromechanical Systems
…The #rst micromachined bimorph organic ciliary array with on-chip CMOS circuitry is presented. This device is composed of an 8 # 8 array of cells eachhaving four orthogonally oriented actuators in an overall die size of 9:4mm# 9:4mm. The polyimide based actuators were fabricated directly above the s…
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